TRI (PCB Inspection)
Automated test and inspection systems for the electronics and manufacturing industries.
TRI
The A.I.TECH Inspection Machine is a new solution that elevates workpiece-inspection efficiency by applying AI to analysis — reducing errors in the inspection process, increasing speed, detecting defects down to the nanoscale, and improving accuracy even on highly complex workpieces. Combined with modern functions and technology, it meets every type of customer application, turning difficult, complex work into something simple.
Inspection Solutions
Elevate SMT Inspection Solutions with AI systems for nanoscale performance.
TR7007Q SII-S 3D Solder Paste Inspection (SPI)
A high-precision 3D system for inspecting the volume and quality of Solder Paste, supporting work in the Advanced Packaging and Semiconductor industries. Designed for high-detail work such as Mini-LED, C4 Bumps, and small components down to the micron scale.
TR7700QH SII
The latest ultra-high-speed 3D AOI inspection machine, the TR7700QH SII can inspect at speeds up to 80 cm²/sec while maintaining Gauge R&R values without compromise. Driven by intelligent programming, AI algorithms, and TRI's metrology measurement capabilities, this 3D AOI inspection machine supports today's smart-factory standards, including IPC-CFX and the Hermes standard (IPC-HERMES-9852).
TR7600FB SII
The latest AXI system features a new X-ray imaging architecture that delivers enhanced image clarity for more accurate inspection.
Powered by 3D AXI technology, AI inspection algorithms, AI void detection, and AI-assisted programming, the TR7600FB SII provides high-speed, intelligent PCB inspection. It supports large PCB sizes of up to 850 × 520 mm with a maximum board weight of 12 kg.
The TR7600FB SII minimizes inspection errors and false calls while maintaining production line throughput, helping manufacturers achieve higher quality and greater efficiency.
TR5001E SII
The TR5001E SII provides a cost-effective and flexible testing solution that meets the requirements of most manufacturing applications. It integrates MDA (Manufacturing Defect Analyzer) with In-Circuit Test (ICT)capabilities and optional Functional Testing, helping reduce labor requirements on the production line.
The ICT platform features automatic calibration and built-in self-diagnostics to ensure long-term testing accuracy, reliability, and consistent performance.
TR7900Q SII (Semiconductor)
The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MP imaging technology, designed for the semiconductor and advanced packaging industries. Powered by AI-driven inspection algorithms and advanced measurement capabilities, it delivers high-performance Smart 3D AOI inspection.
The 3D SEMI AOI system seamlessly integrates with loader/unloader modules for efficient strip and magazine handling. Its Stop-and-Go 3D AOI technology can inspect die bonding, ball bonding, ribbon bonding, wedge bonding, SiP, underfill, SMD bumps, and solder joints with high accuracy.
The Smart Factory AOI solution is capable of inspecting wire diameters as small as 15 μm (0.6 mil), ensuring exceptional precision for advanced semiconductor manufacturing.
TR7600 SIII Plus (Semiconductor)
The TR7600 SIII Plus is TRI’s high-performance 3D SEMI AXI system, designed for industries that demand exceptional reliability, including semiconductors, advanced packaging, automotive, aerospace, and medical devices.
With multi-resolution inspection ranging from 2 µm to 20 µm, the system delivers fast and accurate inspection of critical components such as C4 bumps, SiP, and Cu pillars. The TR7600 SIII Plus supports large PCBs up to 800 × 350 mm with a maximum board weight of 12 kg.
Powered by advanced AI algorithms, including AI Void Detection and AI Repair Station, the TR7600 SIII Plusenhances defect detection accuracy and delivers reliable inspection performance for advanced manufacturing.
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